Poised to take the lead in technological innovation over the next few years, the Singapore-Israel Industrial R&D Foundation (SIIRD) has invested in six new R&D projects amounting to as much as S$10 million.
With today’s hectic lifestyles, consumers demand that electronic devices and gadgets not only provide basic functions but are also smart and versatile enough to meet their diverse needs. This is especially so for indispensible items such as handphones.
Just imagine: A handphone “jacket”, which allows consumers to change the appearance of their handsets and add different features and functionalities — simply by changing “jackets”.
The development of the mechanical structure and connector system for modu2 and its mobile phone “jackets” will be a joint project by modu Ltd, an Israeli mobile handset manufacturer and Amphenol East Asia (Singapore), one of the largest manufacturers of electronics interconnect products in the world. It is one of the six research and development projects recently approved by the Singapore-Israel Industrial R&D Foundation (SIIRD).
The SIIRD is a co-operation between the Singapore Economic Development Board (EDB) and the Office of the Chief Scientist (OCS) in Israel to promote, facilitate and support joint industrial R&D projects between companies from Singapore and Israel.
The cutting-edge technology collaboration projects undertaken under the auspices of SIIRD are poised to reshape the consumer electronics and IT product markets. The beauty of the modu2 system, for example, is that not only can consumers retain the inherent data in their handsets, they can also modify and upgrade their devices as frequently as they wish.
Another SIIRD approved project which is testing the boundaries of digital technology, is being undertaken by Maradin Technologies, developer of novel chipset solutions, and Singapore-based Lynxemi Pte Ltd, turnkey provider of manufacturing development and supply chain management for the semiconductor industry. Lynxemi is developing a 3D Packaging solution for a miniature projection chip — which Maradin is currently developing — to be incorporated into ubiquitous devices such as mobile phones, PDAs and laptops. With this solution for in-device portable projection, mobile professionals will be able to do business presentations on the move without the need to lug around a separate projector. The symbiotic collaboration between both companies results in a win-win combination: Lynxemi’s 3D Packaging solution will not only minimise energy consumption and cost, but will also enhance the performance and brightness of Maradin’s miniature projection chip.
Said Mr. Nishith Prabhakar, Co Founder & Director, Imfinity Pte Ltd, "Imfinity is proud to be part of the coveted SIIRD funding program. The association epitomizes Imfinity's role as a quality software product company. Thanks to SIIRD, we have been successful in identifying a partner in Israel who complements our R&D initiatives and an association with whom will result in the accelerated commercialization of technology in the Asian market space."
The six joint–venture projects are expected to generate cumulative revenues of USD$1.1billion in the first three years of commercialisation. A total of 81 research scientists and engineers from Singapore and Israel will be involved in all the six projects.